Laird Technologies Introduces TFlex 700 Series Thermally Conductive Gap Filler

5.0 W/mK soft gap filler is ideal for thermal interface applications where high compliancy is desirable.

 

Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the launch of its Tflex™ 700 for use as a thermal interface material (TIM).

The Tflex™ 700 is the next generation thermal pad in the Tflex™ gap filler line. It improves the thermal performance of the Tflex™ line by increasing the thermal conductivity to 5.0 W/mK. The soft material is highly compliant, allowing for thinner interfaces and overall improved thermal performance as measured by total thermal resistance. High compliancy accommodates applications where the tolerance stack-up is high and the maximum mechanical stress on the components must be low. A low shore OO hardness value of 50 helps maintain device reliability when mechanical shock and vibration are important design considerations. The Tflex™ 700 is naturally adhesive for ease of handling and assembly.

The Tflex™ 700 thermal material is available worldwide through Laird Technologies’ sales and manufacturing locations. Thickness ranges currently available include 0.040 – 0.200 inch (1mm - 5mm) in 0.010-inch (0.25mm) increments. The product is available in standard sheets or die cut parts that can be custom made to specification. Another available option is adhesive on only one side. The Tflex™ 700 material will be extended as thin as 0.020-inch (.5mm) by the end of 2008.

The Tflex™ 700 is a high-performance solution available to mechanical design engineers working on a wide range of electronic devices including notebook and desktop computers, servers, wireless base stations and radio heads, laptops, LED lighting, set top boxes, LCD and PDP televisions, automotive electronics, and general applications employing heat pipes, heat sinks or thermal modules.

The Tflex™ 700 gap filler thermal interface materials meet the requirements of the RoHS Directive 2002/95/EC issued January 2003 and new standards for low BDA and PFOS. The new material has even lower concentrations of banned substances as required by leading OEM customers.

About Laird Technologies, Inc. 

Laird Technologies designs and supplies customized, performance-critical products for wireless and other advanced electronics applications.

The company is a global market leader in the design and supply of electromagnetic interference (EMI) shielding, thermal management products, mechanical actuation systems, signal integrity components, and wireless antennae solutions, as well as radio frequency (RF) modules and systems.

Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, and industrial markets.

Laird Technologies, a unit of Laird PLC, employs over 14,000 employees in more than 40 facilities located in 14 countries.

Trademarks 

© 2008 All rights reserved.  Laird Technologies and its logo are trademarks of Laird Technologies, Inc.  Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.

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